MemSilicon Completes Tape-Out of MountTai 2026, a 1Gb 1T4R RRAM Chip

1 reports 1 reporting sources 3 days agoNew

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MemSilicon said it has completed tape-out of MountTai 2026, also called Taishan-1, its first-generation high-density RRAM chip based on the 1TnR approach, and validation is underway. The company reports that the chip uses a 28nm CMOS process and a 1T4R structure, with 1Gb capacity, a density of 30Mb/mm², access latency below 20ns and on-chip hardware error correction. The architecture shares one selection transistor across four resistive memory cells to reduce the transistor area overhead per cell.

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Latest development10/14 14:24 (UTC+8)

MemSilicon completes tape-out of MountTai 2026, a 1Gb 1T4R RRAM chip 量子位

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10/14

14:24
量子位
MemSilicon completes tape-out of MountTai 2026, a 1Gb 1T4R RRAM chip
MemSilicon announced on October 12 that it completed tape-out of MountTai 2026, its first-generation high-density RRAM chip based on the 1TnR approach, with validation underway. The company reports a 28nm CMOS process, a 1T4R structure, 1Gb capacity, 30Mb/mm² density, access latency below 20ns, and on-chip hardware error correction. Its architecture shares one selection transistor across four resistive memory cells to reduce transistor area overhead per cell.

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